4-Layer High-Frequency (RF) PCB
| US$1.00 | 1,000 Pieces (MOQ) |
Production Capacity:
1000k/Year
Payment Terms:
T/T
Shenzhen Sun&Lynn Circuits Co., Ltd.
Guangdong, China
Last Login Date:
Apr 07, 2012
Business Type:
Manufacturer/Factory
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Product Description
Company Info
Address:
Xinda Industrial Zone, Jingxiu South Road, Heyi, Shajing Town, Bao′an District, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Computer Products, Electrical & Electronics
Main Products:
PCB Board, Rigid PCB, HDI Board
Company Introduction:
SUN & LYNN CIRCUITS Co., Ltd was established in Hong Kong in 2002 with production facility located in Bao′an District, Shenzhen, Guangdong Province, China.
Plant area is around 30, 000m² with 1500 staffs
Monthly capacity is up to 80, 000m²
Layer count of mass production is 2L to 24L, including regular PCB, heavy copper PCB, Aluminum/Copper based PCB, Hybrid PCB, HDI etc. Applications cover power supply, telecom, fiber optics, industrial control, Auto, consumer electronics.
We are focusing on microware/RF industry, such as power amplifier, tower top amplifier, filter, phase shifter, antenna, base station, GPS and etc. Our max board size is as large as 2000mmX610mm. We have also equipped PLASMA. The main surface finish includes HASL, gold plating, immersion gold, immersion silver, immersion tin, OSP and they are all made in house. We have established good relationship with RF material supplier as well, such as ARLON\ROGERS\NELCO\TACONIC \ISOLA.
We are also specialized in making bonding PCBs, Min IC is 0.1mm/0.1mm. We can ensure the width and evenness inside bonding area, so as to make sure the excellent bonding characteristic. 1 mil bonding force for gold line can reach ≥ 8g and 1 mil bonding force for aluminium line can reach ≥ 6g.
Meanwhile, we possess other outstanding technical capability as well. For high frequency and impedance board we can control tolerance inside ± 5%, and we can make max copper thickness up to 6 oz.
We are a both seasoned and young industrious administration team and well-known of the industry technical trends. Along with the technology progress and clients′ requirement, we will increase investment actively so as to make our technology equipment and management advanced.
Plant area is around 30, 000m² with 1500 staffs
Monthly capacity is up to 80, 000m²
Layer count of mass production is 2L to 24L, including regular PCB, heavy copper PCB, Aluminum/Copper based PCB, Hybrid PCB, HDI etc. Applications cover power supply, telecom, fiber optics, industrial control, Auto, consumer electronics.
We are focusing on microware/RF industry, such as power amplifier, tower top amplifier, filter, phase shifter, antenna, base station, GPS and etc. Our max board size is as large as 2000mmX610mm. We have also equipped PLASMA. The main surface finish includes HASL, gold plating, immersion gold, immersion silver, immersion tin, OSP and they are all made in house. We have established good relationship with RF material supplier as well, such as ARLON\ROGERS\NELCO\TACONIC \ISOLA.
We are also specialized in making bonding PCBs, Min IC is 0.1mm/0.1mm. We can ensure the width and evenness inside bonding area, so as to make sure the excellent bonding characteristic. 1 mil bonding force for gold line can reach ≥ 8g and 1 mil bonding force for aluminium line can reach ≥ 6g.
Meanwhile, we possess other outstanding technical capability as well. For high frequency and impedance board we can control tolerance inside ± 5%, and we can make max copper thickness up to 6 oz.
We are a both seasoned and young industrious administration team and well-known of the industry technical trends. Along with the technology progress and clients′ requirement, we will increase investment actively so as to make our technology equipment and management advanced.
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